Model No.: SMD LED lamp beads 3535
What is "Flip Chip"? How is its structure? What are the advantages?
Blue LEDs usually use Al2O3 substrates. Al2O3 substrates have high hardness, low thermal conductivity and low electrical conductivity. If the front-mounted structure is adopted, on the one hand, it will bring about anti-static problems, on the other hand, heat dissipation will also become a problem under high current conditions SMD lights with LED. The main problem. At the same time, since the front electrode faces upward, a part of the light will be blocked, and the luminous efficiency will be reduced. High-power blue LEDs can obtain more effective light emission through chip flip-chip technology than traditional packaging technology Light Emitting Diode SMD.
The current mainstream flip-chip structure method is: first prepare a large-size blue LED chip with suitable eutectic welding electrodes, and at the same time prepare a silicon substrate slightly larger than the blue LED chip, and fabricate gold for eutectic welding. Conductive layer and lead wire layer (ultrasonic gold wire ball solder joints). Then, the high-power blue LED chip and the silicon substrate are welded together using eutectic Welding equipment. The feature of this structure is that the epitaxial layer is directly in contact with the silicon substrate, and the thermal resistance of the silicon substrate is much lower than that of the sapphire substrate, so the heat dissipation problem is well solved. Since the sapphire substrate faces up after flipping, it becomes the light emitting surface, and the sapphire is transparent, so the light emitting problem is also solved SMD LED lights.
Origin: Guangdong Export or not: Yes Order No.: 12458794 Brand: XiGe Article No.: 5897619 Model: 1206 Size：1206 Power: 0.5 (W) Color rendering index: 80 Luminous flux: 10 (LM) Forward voltage: 12 (V) Reverse voltage: 12 (V) ESD：12（V） Rated current: 10 (a) Chip brand: San'an Chip size: 5 (MIL) Phosphor brand: customizable Glue brand: customizable Wire material: gold wire Bracket material: Copper Luminous angle: 15 (°) Luminous efficiency: 100 (LM / W) Thermal resistance: ≤ 50 (° / W) Maximum allowable junction temperature: 100 (°) Voltage temperature coefficient: 5 (MV / ℃) 1000 hours conventional aging: 85% 6000 hours conventional aging: 20% Lm-80 test passed: Yes Color temperature range: 10 (k) Cross border export source: Yes